eMMC, KLMBG4GEUF-B04Q, KLMCG2KCTA-B041, 2

Pjesa kryesore # / Prodhuesi	Përshkrimi / PDF	Sasia / RFQ
KLMBG4GEUF-B04P Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	15623copë aksionesh
KLMBG4GEUF-B04Q Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	23832copë aksionesh
KLMCG2KCTA-B041 Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	18870copë aksionesh
KLMCG2UCTA-B041 Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	21916copë aksionesh
KLMCG2UCTB-B041 Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Sample.	25787copë aksionesh
KLMCG4JETD-B041 Samsung Semiconductor	eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production.	22900copë aksionesh
KLMCG4JEUD-B04P Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production.	23073copë aksionesh
KLMCG4JEUD-B04Q Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production.	19489copë aksionesh
KLMCG8GESD-B03P Samsung Semiconductor	eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	14184copë aksionesh
KLMCG8GESD-B03Q Samsung Semiconductor	eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production.	24629copë aksionesh
KLMCG8GESD-B04P Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	27174copë aksionesh
KLMCG8GESD-B04Q Samsung Semiconductor	eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production.	21686copë aksionesh
KLMDG4UCTA-B041 Samsung Semiconductor	eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production.	25983copë aksionesh
KLMDG4UCTB-B041 Samsung Semiconductor	eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Sample.	24554copë aksionesh
KLMDG8JEUD-B04P Samsung Semiconductor	eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production.	17647copë aksionesh
KLMDG8JEUD-B04Q Samsung Semiconductor	eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production.	26752copë aksionesh
KLMEG8UCTA-B041 Samsung Semiconductor	eMMC 5.1 256 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production.	14292copë aksionesh

eMMC

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