imazh | Pjesa kryesore # / Prodhuesi | Përshkrimi / PDF | Sasia / RFQ |
---|---|---|---|
Parker Chomerics |
CHO-THERM 1671 DO-5. |
24480copë aksionesh |
|
Parker Chomerics |
CHO-THERM T500 TO-220 0.010. |
66799copë aksionesh |
|
t-Global Technology |
THERM PAD 150MMX150MM WHITE. |
5171copë aksionesh |
|
Bergquist |
THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000 |
718copë aksionesh |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 760 DC1 9x9in |
721copë aksionesh |
|
t-Global Technology |
THERM PAD 35MMX35MM YELLOW. |
99490copë aksionesh |
|
Panasonic Electronic Components |
THERM PAD 108MMX78MM GRAY. Thermal Interface Products Soft PGS - IGBT Mod Mitsubishi Elec. |
6370copë aksionesh |
|
t-Global Technology |
THERM PAD 19.50MMX12.7MM WHITE. |
115457copë aksionesh |
|
t-Global Technology |
THERM PAD 36.83MMX21.29MM W/ADH. |
40137copë aksionesh |
|
t-Global Technology |
THERM PAD 20MMX5MM GRAY. |
334003copë aksionesh |
|
t-Global Technology |
THERM PAD 30MMX30MM BLACK. |
406614copë aksionesh |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 760 9x9" 5.0W/mK gap filler |
741copë aksionesh |
|
t-Global Technology |
THERM PAD 100MMX100MM W/ADH WHT. |
29408copë aksionesh |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. |
744copë aksionesh |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5150 9" x 9" |
752copë aksionesh |
|
3M (TC) |
THERM PAD 41.91MMX28.96MM GRAY. |
58817copë aksionesh |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM BLUE. Thermal Interface Products Tflex 530 18x18" 2.8W/mK gap filler |
754copë aksionesh |
|
Parker Chomerics |
THERMAFLOW 28X28MM 18. |
17096copë aksionesh |
|
t-Global Technology |
THERM PAD 310MMX310MM W/ADH BLK. |
5319copë aksionesh |
|
Parker Chomerics |
T-WING HEAT SPREADER 4X1X1 ADH. |
27028copë aksionesh |