ROHM Semiconductor TCSO Conductive Polymer Capacitors
ROHM Semiconductor TCSO Conductive Polymer Capacitors feature an enhanced bottom electrode configuration, resulting in a more compact package, a lower profile, and greater capacitance. Conductive polymer introduced at the cathode results in lower ESR, contributing to improved safety. Applications include portable devices such as smartphones to automotive and industrial systems.
Features
Conductive polymer used at the cathode for ultra-low ESRBottom electrode configuration results in the greater capacitance
Rohm semiconductor Newest
ROHM Semiconductor ML62Q1747 Reference Board (RB-D62Q1747TB100) is a demonstration and evaluation board featuring the ML62Q1747 16-bit Microcontroller, in a 100-pin TQFP package.
Date: 2019-09-03ROHM Semiconductor ML62Q1552 Reference Board (RB-D62Q1552GA64) is a demonstration and evaluation board featuring the ML62Q1552 16-bit Microcontroller, in a 64-pin QFP package.
Date: 2019-09-03ROHM Semiconductor ML62Q1000 LCD Starter Kit (SK-AD02-D62Q1747TB) enables evaluation of the the features of ML62Q17xx Microcontrollers.
Date: 2019-09-03ROHM Semiconductor ML62Q1557 Reference Board (RB-D62Q1747TB100) is a demonstration & evaluation board featuring the ML62Q1367 16-bit Microcontroller, in a 100-pin TQFP package.
Date: 2019-09-03ROHM Semiconductor ML62Q1722 Reference Board (RB-D62Q1722GA64) is a demonstration and evaluation board featuring the ML62Q1722 16-bit Microcontroller, in a 64-pin QFP package.
Date: 2019-09-03ROHM Semiconductor ML62Q1000 MCU Starter Kit (SK-BS01-D62Q1577TB) is an evaluation kit designed to demonstrate the features of the ML62Q1000 Microcontrollers.
Date: 2019-09-03ROHM Semiconductor TCTO Series Tantalum Capacitors are available at Mouser Electronics and are ultra-high performance low-ESR, with a bottom electrode configuration.
Date: 2019-08-21ROHM Semiconductor TCSO Series Conductive Polymer Capacitors are available at Mouser Electronics and feature an efficient package design featuring larger capacitance in a smaller, thinner form factor.
Date: 2019-08-20
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