eMMC


imazh Pjesa kryesore # / Prodhuesi Përshkrimi / PDF Sasia / RFQ
KLM4G1FETE-B041

KLM4G1FETE-B041

Samsung Semiconductor

eMMC 5.1 4 GB 1.8, 3.3 V / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C Mass Production.

15482copë aksionesh

KLM8G1GESD-B03P

KLM8G1GESD-B03P

Samsung Semiconductor

eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

22853copë aksionesh

KLM8G1GESD-B03Q

KLM8G1GESD-B03Q

Samsung Semiconductor

eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

14400copë aksionesh

KLM8G1GESD-B04P

KLM8G1GESD-B04P

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

15632copë aksionesh

KLM8G1GESD-B04Q

KLM8G1GESD-B04Q

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

20904copë aksionesh

KLM8G1GETF-B041

KLM8G1GETF-B041

Samsung Semiconductor

eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.

17324copë aksionesh

KLM8G1GEUF-B04P

KLM8G1GEUF-B04P

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

22980copë aksionesh

KLM8G1GEUF-B04Q

KLM8G1GEUF-B04Q

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

22628copë aksionesh

KLMAG1JETD-B041

KLMAG1JETD-B041

Samsung Semiconductor

eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.

17024copë aksionesh

KLMAG2GESD-B03P

KLMAG2GESD-B03P

Samsung Semiconductor

eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

16293copë aksionesh

KLMAG2GESD-B03Q

KLMAG2GESD-B03Q

Samsung Semiconductor

eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

16354copë aksionesh

KLMAG2GESD-B04P

KLMAG2GESD-B04P

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

18823copë aksionesh

KLMAG2GESD-B04Q

KLMAG2GESD-B04Q

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

17877copë aksionesh

KLMAG2GEUF-B04P

KLMAG2GEUF-B04P

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.

18865copë aksionesh

KLMAG2GEUF-B04Q

KLMAG2GEUF-B04Q

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.

26635copë aksionesh

KLMBG2JETD-B041

KLMBG2JETD-B041

Samsung Semiconductor

eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.

23162copë aksionesh

KLMBG4GESD-B03P

KLMBG4GESD-B03P

Samsung Semiconductor

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.

21846copë aksionesh

KLMBG4GESD-B03Q

KLMBG4GESD-B03Q

Samsung Semiconductor

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production.

25702copë aksionesh

KLMBG4GESD-B04P

KLMBG4GESD-B04P

Samsung Semiconductor

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.

22661copë aksionesh

KLMBG4GESD-B04Q

KLMBG4GESD-B04Q

Samsung Semiconductor

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.

22160copë aksionesh

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