eMMC, KLM8G1GESD-B03P, KLM8G1GESD-B03Q, 0

Pjesa kryesore # / Prodhuesi	Përshkrimi / PDF	Sasia / RFQ
KLM4G1FETE-B041 Samsung Semiconductor	eMMC 5.1 4 GB 1.8, 3.3 V / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C Mass Production.	15482copë aksionesh
KLM8G1GESD-B03P Samsung Semiconductor	eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	22853copë aksionesh
KLM8G1GESD-B03Q Samsung Semiconductor	eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	14400copë aksionesh
KLM8G1GESD-B04P Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	15632copë aksionesh
KLM8G1GESD-B04Q Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	20904copë aksionesh
KLM8G1GETF-B041 Samsung Semiconductor	eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	17324copë aksionesh
KLM8G1GEUF-B04P Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	22980copë aksionesh
KLM8G1GEUF-B04Q Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	22628copë aksionesh
KLMAG1JETD-B041 Samsung Semiconductor	eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	17024copë aksionesh
KLMAG2GESD-B03P Samsung Semiconductor	eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	16293copë aksionesh
KLMAG2GESD-B03Q Samsung Semiconductor	eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	16354copë aksionesh
KLMAG2GESD-B04P Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	18823copë aksionesh
KLMAG2GESD-B04Q Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	17877copë aksionesh
KLMAG2GEUF-B04P Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	18865copë aksionesh
KLMAG2GEUF-B04Q Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	26635copë aksionesh
KLMBG2JETD-B041 Samsung Semiconductor	eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	23162copë aksionesh
KLMBG4GESD-B03P Samsung Semiconductor	eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	21846copë aksionesh
KLMBG4GESD-B03Q Samsung Semiconductor	eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production.	25702copë aksionesh
KLMBG4GESD-B04P Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	22661copë aksionesh
KLMBG4GESD-B04Q Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	22160copë aksionesh

eMMC

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