Prodhuesi Aavid, Produktet e disponueshme Aavid

Pjesa kryesore # / Prodhuesi	Përshkrimi / PDF	Sasia / RFQ
321127B00000 Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK.	21758copë aksionesh
2286BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Extruded Heatsink, Radial Fin, Square, 0.79x0.155 Inch	11128copë aksionesh
6084BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 8.38x13.21x19.05mm	81884copë aksionesh
6263B-MT5G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks High-Rise Style Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, Black Anodized, 10.16x44.45x44.7mm	44944copë aksionesh
2207/PR11B ASSY Aavid, Thermal Division of Boyd Corporation	HEAT SINK.	3163copë aksionesh
7025BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Channel Style Heatsink for TO-220, Folded Back Fins, Vertical Mounting, 6.8 n Thermal Resistance, No Solderable tabs, 2.90mm Hole	141875copë aksionesh
6273BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Board Level Stamped Heatsink for TO-202, Vertical Mounting, 9.52x19.05x19.05mm	71827copë aksionesh
2283B Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK.	6911copë aksionesh
341600F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm	36131copë aksionesh
6381BG Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Heatsink for MULTIWATT, Vertical Mounting, 5.8 n Thermal Resistance, Black Anodized, 2.89mm Hole, 38.1mm, Solderable Pins	38264copë aksionesh
326005R00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink for TO-5, Vertical Mounting, 12.7x12.7x9.52mm	54891copë aksionesh
2207/PR11B ASSYG Aavid, Thermal Division of Boyd Corporation	HEATSINK.	2070copë aksionesh
335714B00000G Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 30x30x7mm, IC Pkg Size = 30 x 30, Epoxy	103241copë aksionesh
322805B00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Vertical Mounting, 22.23x22.23x13.49mm	39987copë aksionesh
342000F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm	23471copë aksionesh
115600F00000G Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Rail Mounting Heatsink Clip, Stainless Steel	473765copë aksionesh
1130BG Aavid, Thermal Division of Boyd Corporation	HEATSINK. Heat Sinks Thermal Link with BeO Insulator for TO-5, Vertical Mounting, Black Anodized, 15 n Thermal Resistance	9207copë aksionesh
325705R00000G Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height	54530copë aksionesh
6000DG Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks Stamped Heatsink for Axial Lead Devices, Vertical Mounting, Copper, 15 n Thermal Resistance, Tin Plated	46895copë aksionesh
335214B00000G Aavid, Thermal Division of Boyd Corporation	HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 25x25x10mm, IC Pkg Size = 25 x 25, Epoxy	73229copë aksionesh

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