imazh | Pjesa kryesore # / Prodhuesi | Përshkrimi / PDF | Sasia / RFQ |
---|---|---|---|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. |
3940copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. |
24497copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Extruded Heat Sink |
44106copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Extruded Heat Sink |
22610copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Heatsink for MULTIWATT, Vertical Mounting, 4.2 n Thermal Resistance, Black Anodized, 2.89mm Hole, 50.8mm, Solderable Pins |
33521copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
15033copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
58222copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Extruded Heat Sink |
38885copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink, Black Anodized |
17889copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Channel Style Stamped Heatsink with Slide-On Integrated Clip and Locking Tabs for TO-220, Vertical Mounting, 18 n Thermal Resistance, 3.81mm Hole |
66319copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 30x30x9mm, IC Pkg Size = 30 x 30, Epoxy |
103566copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Extruded Heat Sink |
10015copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
30481copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 27x27x11mm, IC Pkg Size = 27 x 27, Metal, Tape #32 |
58352copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Slide-On Style Board Level Stamped Heatsink for Integrated Clip and Solderable Tabs for SIPS, Copper, Vertical Mounting, 16 n Thermal Resistance, Tin Plated, 2.54mm Hole |
63728copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Square Basket Style Board Level Stamped Heatsink for TO-220, Horizontal Mounting, Black Anodized, 45.21x45.21x18.29mm |
22254copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks Channel Style Stamped Heatsink for TO-220, Horizontal/Vertical Mounting, 17 n Thermal Resistance, 29.97mm Height |
50586copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Extruded Heatsink for TO-220, 0.059mm Height |
22230copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Thin-Fin Board Level Stamped Heatsink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4x76.2x0.33mm |
16537copë aksionesh |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. |
1857copë aksionesh |